Development of Low-Toxicity Organic Solder Preservative Earns Patent for Hsieh Chung-Hung, Tung Chong-Min, Liao Yu-Lun, and Others.

Associate Professor Hsieh Chung-Hung from the Department of Chemistry, Professor Tung Chong-Min from the Department of Chemical and Materials Engineering—who also serves as President of the Taiwan Chitin and Chitosan Biomaterials Society—collaborated with senior chemistry student Liao Yu-Lun and alumni Tsai Ming-Chieh, Chen Shih-Yun, Liu Chia-Yi, and Huang Hsiang-Yun to develop an ‘organic solder preservative, method for forming organic solder film, use of polymers as solder preservatives, and electronic substrate with organic solder film.’ This eco-friendly innovation for electronic manufacturing has been awarded a patent by the Intellectual Property Office of the Ministry of Economic Affairs in the Republic of China. The patent is valid from April 1, 2025 to May 21, 2043, covering a period of 18 years.